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| General Information XDRTM DRAM XDRTM DRAM Product Guide Revision 0.5 Mar. 2006 Change History Revision 0.1 (August 03) - First Copy Revision 0.2 (Dec 04) - Add C-die, D-bin Revision 0.3 (Mar 05) - Add 512Mb XDR DRAM Revision 0.4 (Dec 05) - Delete code 17 in organization Revision 0.5 (Mar. 06) - Add E-die XDR is a trade mark of Rambus Inc. General Information A. XDR DRAM Ordering Information 1 2 3 4 5 6 7 8 9 10 XDRTM DRAM 11 K4 YXXXXXXX-XXXX SAMSUNG Memory DRAM Product Density & Refresh Organization Speed Temperature & Power Package Type Revision Interface (VDD) Bank 1. SAMSUNG Memory : K 2. DRAM : 4 8. Revision M : 1st Gen. C : 4th Gen. E : 6th Gen. F : 7th Gen. 3. Product Y : XDR DRAM 4. Density & Refresh 54 : 256M, 16K/16ms(0.98us) 50 : 512M, 32K/16ms(0.49us) 9. Package Type J : BOC lead free 10. Temperature & Power 5. Organization 02 04 08 16 : : : : x2 x4 x8 x16 C : Commercial, Normal Power 11. Speed (Data frequency, tRAC, tRC) DS : for Daisy chain Sample 6. Bank 4 : 8 Banks A2 : 2.4Gbps, 36ns, 16cycles B3 : 3.2Gbps, 35ns, 20cycles C3 : 3.2Gbps, 35ns, 24cycles C4 : 4.0Gbps, 28ns , 24cycles 7. Interface ( VDD, VDDQ) U : DRSL(1.8V,1.2V ) General Information B. XDR DRAM Component Product Guide Density Banks Part Number K4Y54044UF-J 256Mb(F-die) 8 Banks *1C XDRTM DRAM Speed*2 A2/ B3/ C4 Org. 64Mx4 32Mx8 16Mx16 256Mx2 128Mx4 64Mx8 32Mx16 256Mx2 Power(V) Refresh Package Type Availability K4Y54084UF-JC K4Y54164UF-JC K4Y50024UC-JC K4Y50044UC-JC K4Y50084UC-JC K4Y50164UC-JC K4Y50024UE-JC K4Y50044UE-JC K4Y50084UE-JC K4Y50164UE-JC 1.8V 0.09 16K/16ms 104ball BOC EOL 512Mb(C-die) 8 Banks A2/ B3/ C4 1.8V 0.09 32K/16ms 104ball BOC Now 512Mb(E-die) 8 Banks A2/ B3/ C4 128Mx4 64Mx8 32Mx16 1.8V 0.09 32K/16ms 100ball BOC Q4'06 *1 Package Type Description BOC lead free J *2 Speed ( tRAC & Freq.) Code C4 B3 C3 A2 Description (Data frequency. tRAC, tRC) 4000Mbps, -28, 24clks 3200Mbps, -35, 20clks 3200Mbps, -35, 24clks 2400Mbps, -36, 16clks Code |
Price & Availability of K4Y50084UE-JC
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